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In the field of AI intelligent computing, with the rapid development of artificial intelligence technology, computing platforms need to continuously break through performance bottlenecks to support large-scale data processing and complex computing tasks. The TGV advanced packaging and 3D waveguide technologies of Shenguang Valley Technology provide an ideal optical interconnection solution for AI intelligent computing.


The TGV advanced packaging technology can provide a high-density and low-power consumption CPO optical engine solution for AI computing platforms. Through the TGV technology, optical interconnections between XPUs (such as GPUs, CPUs, TPUs) in the AI platform can achieve higher transmission rates and lower latency. This makes the data flow during AI training and inference more efficient, especially in large-scale parallel computing, which can effectively improve the overall performance of the system. At the same time, due to the low-power consumption characteristics of the TGV technology, it can significantly reduce energy consumption, ensuring that the AI computing platform has a higher energy efficiency ratio while maintaining high performance, which meets the requirements of future green computing.


The 3D waveguide technology can provide multi-channel high-density optical connectors for AI computing platforms, especially suitable for silicon photonics chips. By combining the 3D waveguide technology with silicon photonics chips, Shenguang Valley Technology can achieve higher-density optical connections to meet the challenges of optical interconnections in large-scale AI computing requirements. These high-density optical connectors can ensure efficient data exchange between different computing units in the AI computing platform, thereby improving computing efficiency and data processing speed, providing a solid foundation for the rapid training and inference of AI algorithms.


Through the TGV and 3D waveguide technologies, Shenguang Valley Technology has provided flexible and efficient optical interconnection solutions for AI intelligent computing, supporting the development of the next-generation intelligent computing platform and promoting further breakthroughs in AI technology.


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