8 channels Tx TGV Optoelectronic Interposer Chip

The 8channels Tx TGV optoelectronic interposer chip uses laser induction and deep silicon etching to achieve glass-based signal switching, and uses the redistribution layer (RDL) and micro-bump process to achieve a wiring bandwidth of more than 110GHz, significantly improving signal transmission efficiency and density; matching the mainstream eight-channel silicon photonic modulation chip and electric driver chip to achieve an 8-channel standardized solution, while being compatible with the pin definitions of mainstream silicon photonic chips and electric chips, achieving a high degree of integration of optoelectronic hybrid packaging; laser direct writing optical waveguides and interposer internal slots can be integrated on the chip to achieve low-loss and high-density optical path fan-in and fan-out.